Held on 6–7 May in Warsaw, the meeting was filled with technical discussions and valuable exchanges of experience between our certification body members.
Over the two days, we covered a wide range of important topics, including:
✔️ Liaison items with CLC/TC 108X, including temperature limits, impact testing, and VDRs in primary circuits.
✔️ Clarification of routine tests for products with integrated lasers following a question from OSM FIP.
✔️ Review of withdrawn standards and proposals for deletion within the ENEC framework.
✔️ Several technical questions under EN 62368-1, including moisture protection, touch current evaluation, VDR configurations, fuse ratings, and safety aspects related to wireless earbuds with button cells.
✔️ Broader safety topics such as ventilation for NiMH batteries, solid insulation thickness, and the potential impact of IEC 60384-14:2023 on product certification.
A special thank you to Kris de Potter for stepping in as replacement Chair and leading the meeting. We would also like to warmly thank CB Association of Polish Electricians – Quality Testing Office (SEP – BBJ) for the excellent organisation and hospitality. And thank you to all the participants for their contributions!
Looking forward to continuing these discussions at the next OSM EE meeting in 2027.
